Contact us today for more details of XCede HD, part number 968-4200-A1H. Please confirm your currency selection:2. 1. XCede® connectors also address Xcede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. Mouser offers inventory, pricing, & datasheets for XCede High Speed/Modular Connectors. 0 TOOLING 1. Send us a Message. Login or REGISTER Hello, {0}. The series offers mechanical. The XCede ® HD Plus backplane connector achieves high . XCede® connectors also address requirements for high linear signal density at the backplane and daughter card interface. This type of cable is suitable for high-density networks and can reach a much longer distance than DAC and AOC. Upload your CV. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 2. Wang 6/19/19. Attention! Your ePaper is waiting for publication! By publishing your document, the content will be optimally indexed by Google via AI and sorted into the right category for over 500 million ePaper readers on YUMPU. 三个等级的上电次序实现了热插拔. 0 REFERENCE 2. 00mm pitch (FF5026) and 050mm pitch (FF3025). Random Access Memory, or RAM (pronounced as ramm ), is the physical hardware inside a computer that temporarily stores data, serving as the computer's "working" memory. Offering a linear density of up to 84 differential pairs per inch and can meet requirements of high density architectures. 4. XCede Connectors are available at Mouser Electronics. We would like to show you a description here but the site won’t allow us. 4 differential pairs/inch. Basically, it is how all major components inside a computer talk with each other. The system’s. Manufacturer of Connector and Connector Systems. Amphenol Communications Solutions. Up to 3. Choice of 2 or 4 power banks. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede ® HD Plus connector meets the high density needs of today's challenging architectures. The SMA (or Sub-Miniature A) connector has a 50Ω impedance and can handle frequencies up to 17 GHz. A HIGH-DENSITY, DIFFERENTIAL, LOW-COST CONNECTOR SOLUTION FOR DATA RATES UP TO 14 GBPS. Click OK to extend your time for an additional 30 minutes. Español $ USD United States. Dislaime Please note that the above information is subect to change without notice. 6amps per mm. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. DETAILS. +44 (0)203 301 9900. 1. 3-, 4- and 6-pair designs. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. This connector ships without wires, terminals and seals. 4-, 5-, 6-, 8-pair configurations. - FCI. Designed to meet UL 1977 CAF (Conductive Anodic Filament) spacing Housing: High-temperature thermoplastic, UL94-V0 Wafers: High-temperature thermoplastic, UL94-V0 Contacts: High-performance copper alloy Platings. Amphenol Communications Solutions XCede high-performance backplane connector system. 1. 2. Amphenol TCS XCede® Backplane Connectors are designed to offer readily available 85Ω and 100Ω solutions while maintaining the same mating interfaces. Backwards mating compatible with XCede ® HD connector. XCede® HD 1. The XHD+ DC system will offer two (2) primary guidance systems, (1) the standard guide module receptacle; and (2) the wide guide. 54, 3. Features. 2" long and has an x4 connector. 062") thick cards. XCede® connectors also. XCede® connectors also address. 80 mm column pitch. High-speed, high-density backplane systems include ExaMAX ® and XCede ® HD in a variety of pair and column counts. FCI. XCede HD achieves the highest performance in an HM compatible form factor. You previously purchased this product. 8 mm column pitch representing a 35% increase versus XCede®. 2. MTP to 4x LC breakout cable is composed of an 8-fiber MTP connector for 40G QSFP+ at one end and 4 duplex LC connectors for 10G SFP+ at the other end. A HIGH-DENSITY, DIFFERENTIAL, LOW-COST CONNECTOR SOLUTION FOR DATA. 1. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. XCede® Family Cable Assemblies § Extends the reach of passive copper for next generation real world system designs; complementary with direct orthogonal designs, intermatable with existing board mount connector designs § Lowers overall system costs by reducing or eliminating the need for expensive active devices like retimers and high TB-2253 XCede HD Family Daughtercard Wafer Removal and Replacement. View eCAD Files. 1 FMC VITA 57. Features. EIA-364-B Electrical Connector Test Procedure Including Environmental Classifications 2. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. We would like to show you a description here but the site won’t allow us. Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions. Multiple signal/ground pin staging options. 7. XCede High Speed/Modular Connectors are available at Mouser Electronics. 1. Mouser offers inventory, pricing, & datasheets for Amphenol Xcede Series High Speed/Modular Connectors. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. TARGET MARKETS. 1. Up to 82 differential pairs per linear inch. 1. Skip to Main Content (800) 346-6873. The XCede ® HD Plus backplane connector achieves high . Pin header. § Differential pairs 28-84 per inch (11-33 differential pairs perAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Mouser offers inventory, pricing, & datasheets for Samtec XCede High Speed / Modular Connectors. ENABLING FUTURE DATA RATES While maintaining the same mating interfaces, this connector design provides. Two press-fit sizes, (standard and small) provide board layout options for designers. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. XCede® Family Cable Assemblies § Extends the reach of passive copper for next generation real world system designs; complementary with direct orthogonal designs, intermatable with existing board mount connector designs § Lowers overall system costs by reducing or eliminating the need for expensive active devices like retimers and high XCede HD2 backplane interconnect system. The XCede product family encompasses XCede®, XCede Plus®, and X2 product lines, and their corresponding product derivatives including; Daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male direct-attach orthogonal (RAM DA ortho), and cable backplane interconnect systems. Brand of Product：Amphenol ICC,Part#：946-230X-13X,Product Category：EXTENDED RAM MODULE,Data Type：Outline Dimension Drawing. 08mm. 99 $ 19. Login or REGISTER Hello, {0}. Out of these, the cookies that are categorized as necessary are stored on your browserGermany. 2 - One mezzanine card per node, mirrored ; 3 - Two IO Modules per node, mirrored. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. Farnell Ireland offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. Dislaime Please note that the above information is subject to change without notice. Revision “D” Specification Revision Status . The system’s modularity gives designers the opportunity to create a fully custom backplane solution with optional power modules, guidance. TARGET MARKETS. The stiffener may help straighten the board edge, but this does not necessarily preclude the need for additional board stiffening. 2. 1. Memory card connector / PCI. /PRNewswire/ -- Newark/element14, a leading multi-channel, high-service electronics distributor in the Americas, and a business of global Premier Farnell,. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Amphenol TCS XCede® Backplane Connectors. FCI 159 KAMPONG AMPAT, KA, PLACE,. XCede® Stacker. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 3A per pin current rating and mount individually to the backplane. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede ® HD Plus connector meets the high density needs of today’s . Farnell Israel offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine,. For optimal connector configuration, connectors are grouped into signal modules of 4,. Search for: Search Home; Categories. XCede® connectors also address. Mouser offers inventory, pricing, & datasheets for Amphenol XCede HD Series Backplane Connectors. Formed in 2020 by a merger of three well. DETAILS. XCede® connectors also address requirements for high linear signal density at the backplane. 2. 8 mm, Header, Press Fit. The types of memory modules available today can be broadly classified into Single In-Line Memory Module (SIMM) and Dual In-Line Memory Module (DIMM). DC configurations may also be determined by the XHD2 RAM connector to which they will mate for co-planar applications. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling. The XCede backplane connector system provides mechanical longevity and ruggedness required by today’s systems. These modules consist of a 12. Nashua, NH, February 2, 2009– Amphenol TCS, the leading provider of high performance backplane interconnect systems, today announced two additions to the XCede® connector platform – XCede 85 Ohm and XCede cables and assemblies. Article: 00028492. 2. XCede® connectors also address. Improves signal integrity and increases signal. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. Receptacle connectors and pin connectors are through-hole devices with eye-of-the-needle compliant pin contacts. for connector repairability. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. English. Farnell UK offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. Same mechanical benefits as backplane connectors; High pin counts, blind mate & high density; Low loss twin ax cable; Overcomes limitation of PCB materials; Linear transmission to ~30 GHz; Enables 25G NRZ and 56G PAM4; Flexible pin out; Allows for full mesh designs with cable harnesses; 30 - 26 AWG wire gauges; Optimization of transmission. XCede ® High-Performance Backplane Connector System. TARGET MARKETS. Board-to-board connector / right-angle / female The XCede® Right-Angle Male (XCede® RAM) connector is an intelligent device that offers two options for designers. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD Plus connector meets the high-density needs of today's challenging architectures. 1 DOCUMENTS 2. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. . EN. XCede® HD 1. 4、6或8列. Description Initial Date “A” S2401 Initial Release E. 4 differential signal pairs per inch are provided corresponding to a minimum slot spacing of 36 mm. Our solutions include Wire-to-Board, Board-to-Board, Input/Output and FFC/FPC. backplane to expander board connector (BP_XCEDE_3) 2. Customer Measurement Report: FCI XCede® Connector. 1. XCede® connectors also address. Amphenol solves system design challenges with integrated interconnect solutions for applications in the networking, communications, storage, and computer server markets. No spam. Integrated power and guidance. Get a Free Sample. Search for: Search Home; Categories. Connections hint for November 24. element14 Malaysia offers special pricing, same day dispatch, fast delivery, wide inventory, datasheets & technical support. 0 REFERENCEDOCUMENTS 2. XCede HD achieves the highest performance in an HM compatible form factor. Column counts of 4, 6 and 8 allow for sizing the connector to the required differential pair count. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 20mm HPTS Power Modules feature press-fit tails, vertical mounts, and come in a variety of body heights to match signal module pair count. 80mm Right-Angle Backplane Receptacle (HDTF). signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. Login or REGISTER Hello, {0}. XCede Daughter Card PWB + Fixture Thickness Requirements and Compliant Pin Protrusion Lengths XCede Connector Type/Size PWB + Fixture Thickness Minimum (mm) 0. Available in straddle mount, through-hole termination and also SMT. high speed performance, paddle card edge connector series for next Gen. This website uses cookies to improve your experience while you navigate through the website. 54 - 5. Distance Graph showing two shapes of the knee area utilizing an 2 - One mezzanine card per node, mirrored ; 3 - Two IO Modules per node, mirrored. 3、4和6对设计. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Buy 928-4000-A7H - Amphenol Communications Solutions - Connector, 4 Diff Pair, XCede HD Series, Receptacle, Press Fit. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Submit a Brief. - FCI. 2-, 3-, 4-, 5-, 6-Pair configurations. It’s as simple as choosing a base, a compatible arm, and a compatible device holder or adapter for your specific device. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. Mouser offers inventory, pricing, & datasheets for Samtec XCede High Speed / Modular Connectors. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. performance (up to 28+ Gb/s) in a Hard Metric form factor. Skip to Main Content (800) 346-6873. Login or REGISTER Hello, {0}. Rugged Edge Rate® contact system. Vertical or Right Angle. 1 DOCUMENTS 2. $ 129. Other items. 60mm Gen-Z connectors conform to SFF-TA-1002, OCP NIC 3. Features. Xcede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. We offer interconnection systems from 2. Basics is present with its full range of products to meet the needs of our customers. 2 The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male Amphenol Communications Solutions XCede high-performance backplane connector system. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. Figure 20: Example XCede® HD Midplane Connector 20 LIST OF TABLES Table 1: XCede® HD , XCede® HD Plus and XCede® HD2 15. Amphenol is one of the leading manufacturers of Backplane connectors. Features. Sloan 2-09-09 “A” S1979 Updated procedure, and addition of RAM and Stacker M. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Meets the high density needs of today's designs. Login or REGISTER Hello, {0}. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The stiffener may help straighten the board edge, but this does not necessarily preclude the need for additional board stiffening. Samtec XCede® HD 3. 1 DOCUMENTS 2. Wide shield contacts feature a stiffness enhancing rib and are advanced well ahead of the signals for “drag your finger across” robustness. Pitch (mm): Circuits: Current (MAX per contact): Voltage: 1. 4、6或8列. 1 Fillets An extension of the pad at the interface of the trace to the pad that will allow more pad area in the event that the pad to hole registration compromises the interconnect area. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. 4, 6 or 8 columns. 2. Complementary guide and power modules are also included in the product range. XCede® connectors also address. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets requirements of high density architectures with 35% increase in density as compared to standard XCede®. Connectors; Diodes & Rectifiers; Embedded Processors & Controllers; Embedded Solutions; EMI/RFI Components; Enclosures;XCede High Speed / Modular Connectors are available at Mouser Electronics. EN. 20mm HPTS Power Modules feature press-fit tails, vertical mounts, and come in a variety of body heights to match signal module pair count. See section 4 regarding XHD2 RAM connectors. 0217" Drill XCede HD & XCede HD PLUS press fit backplane connector family onto a printed circuit board (PCB). 0 DEFINITIONS 4. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 10% coupon applied at checkout Save 10% Details. Available in industry-standard 2. 2. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Same mechanical benefits as backplane connectors; High pin counts, blind mate & high density; Low loss twin ax cable; Overcomes limitation of PCB materials; Linear transmission to ~30 GHz; Enables 25G NRZ and 56G PAM4; Flexible pin out; Allows for full mesh designs with cable harnesses; 30 - 26 AWG wire gauges; Optimization of transmission and. XCede® connectors also address. See Appendix "A" for the seating press recommendations and process recommendations. Contact us today for more details of XCede HD, part number 968-4200-A1H. 20mm Power Modules. Formed in 2020 by a merger of three well. Login or REGISTER Hello, {0}. Female pin. asm jx410-51594_bp. Up to 3. 3. EN. Receptacle connectors and pin connectors are through hole devices with eye-of-the-needle compliant pin contacts. Your Price. 4. XCede connectors also address requirements for higher linear signal density at the backplane or midplane interface. ExaMAX® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. see tb-xxxx for board weight limitations. Find Parts Learn More. 54mm pitch down to 0. The XCede HD connector. 00mm pitch (FF5026) and 050mm pitch (FF3025). 2. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling. 4, 6 or 8 columns. DETAILS. They are available in 1. Mouser offers inventory, pricing, & datasheets for XCede High Speed / Modular Connectors. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCede® connectors also address. Standard or high-speed wafers available. Part # dimensions for each XCede connector type. TARGET MARKETS. Contact Mouser (USA) (800) 346-6873 | Feedback. Price request; Print; Specifications. backplane to expander board connector (BP_XCEDE_2) 3. The standard XHD2 differential interconnect platform consists of connectors featuring 3, 4, or 6 differential pairs, with an optional extra ground lead available on the A wafer. The XCede ® HD Plus backplane connector achieves high . Login or REGISTER Hello, {0}. Welcome to Wille Dodge, a family-owned dealership with 44 years of. 3. 8 mm, Receptacle, Press Fit. XCede 85 Ohm for applications where matching lower system impedance is desired and XCede cable. View in Order History. Login or REGISTER Hello, {0}. Pitch (mm): Mated Height (mm): Circuits: Current (MAX): 2. 9 signal pairs per inch are. For XCede HD RAM. Four-pair connectors provide 54. It is intended to provide general guidance for development of customer designs It is intended to provide general guidance for development of customer designs and application processes as they relate to this product family. 1. ExaMAX®可实现高达56 Gbps的性能，并使设计师能够选择优化密度或最大程度地减少电路板层数。. High-speed, high-density backplane systems include ExaMAX® and XCede® HD in a variety of pair and column counts. Mouser offers inventory, pricing, & datasheets for Amphenol Xcede Series High Speed / Modular Connectors. 8 mm column pitch representing a 35% increase versus XCede®. Buy 928-4000-A7H - Amphenol Communications Solutions - Connector, 4 Diff Pair, XCede HD Series, Receptacle, Press Fit. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. Delete of interface FortyGigE1/0/49, and then exit the system mode and save the configuration. 2 617-0450-014 xcede hd 4pair stiffener 1 1 922-421f-d3h xcede hd 4pair lc mod w/ organizer, 8pos, 100ohms, bifurcated, . 3. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 0A: 250V: EXTreme OrthoPowerНа страницах каталога оборудования вы найдете Connectors: board-to-board различных производителей - большой выбор оборудования и техники. 6 %âãÏÓ 2647 0 obj > endobj 2677 0 obj >/Encrypt 2648 0 R/Filter/FlateDecode/ID[65646E18716E2B4991C9C621A98364C7>]/Index[2647 447]/Info 2646 0 R/Length 155. Login or REGISTER Hello, {0}. 1. Features. Backwards mate compatibility. 00 mm contact wipe on signal pins. The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal,. They can either add a new cabling solution with backplane components at right angles, or expand their systems horizontally. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Secured form. Features & Benefits. Reboot the switch to enable the change. KK connector systems are customizable for a variety of power and signal applications. XCede® connectors also address. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. Login or REGISTER Hello, {0}. 0 REFERENCE 2. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with coolingComponents. 5 out of 5 stars 3,424. Integrated guidance, keying and polarizing side walls available. XCede® BACKPLANE CONNECTOR SYSTEM DESCRIPTION XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Modular design provides flexibility in applications. XCEDE® BACKPLANE CONNECTOR SYSTEM XCEDE® POWER SYSTEM 150 grams normal force nominal POWER RATING Modular construction gives an effective current density of 8. 2 Reference Documents TB-2235 XCede HD General Product Specifications TB-2237 XCede HD Routing Guidelines TB-2252 XCede HD Backplane Connector Installation 2. 40G QSFP+ to QSFP+ AOC Cable. The series offers mechanical longevity and ruggedness, guidance and keying options, and. Samtec’s Eye Speed® ultra low skew twinax cable provides increased flexibility and routability. Specs Kit. XCede Plus Backplane Connector. These connectors are ideal for meeting a wide variety of application needs, including Ethernet and PCI. XCede® Backplane Connector MATERIAL §§Housing: Liquid Crystal Polymer §§Contact Base Metal: Copper Alloy §§Plating: Performance-based plating at separable interface; meets requirements of product specification ELECTRICAL PERFORMANCE §§Signal Current Rating: 1A per contact §§Ground Current Rating: 2A per contactAmphenol's Flat Flexible Cable (FFC) Jumpers are available in a wide range of standard cable lengths to meet the wide range of flexible interconnect requirements between two PC boards. Features & Benefits. This document describes the methods and tooling for the installation of Amphenol TCS XCede HD,XCede HD PLUS&XCede HD2right angle press-fit daughtercard connectors onto a printed circuit board (PCB). Login or REGISTER Hello, {0}. TB-2023 Amphenol TCS Commercial Connector Qualification Plan TB-2237 XCede HD Routing Guidelines 2. Download M12 PCB MOUNT CONNECTOR, X-CODED, FEMALE. Vertical backplane header configurations provide two, four or six differential signal pairs per column wafer with four, six or eight wafers per signal connector module. 11. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. XCede® HD is a small form factor system with a modular design for significant space savings and. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD Plus connector meets the high-density needs of today's challenging architectures. XCede® connectors also address. Amphenol Communications Solutions. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. We would like to show you a description here but the site won’t allow us. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. Get the best deals on Amphenol Backplane Connectors Connectors when you shop the largest online selection at eBay. 下载3D模块 配置并加入到购物车 配置免费样品 技术参数. These modules consist of a 12. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Revision SCR No. The XCede HD2 connector family consists of modular configurations with custom power and guidance. XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY While maintaining the same mating. 2. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 1. Features. Login or REGISTER Hello, {0}. 4-, 5-, 6-, 8-pair configurations. 4. 2. 1. It is intended to provide general guidance for development of customer designs It is intended to provide general guidance for development of customer designs and application processes as they relate to this product family. If you need to add wires, there is an additional cost: please contact us and we will help you get the order processed. Login or REGISTER Hello, {0}. Login or REGISTER Hello, {0}. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Pitch (mm): Mated Height (mm): Circuits: Current (MAX): 2. XCede ® HD and XCede ® HD Plus, this connector provides . challenging architectures. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 32. Page 174 Figure 127. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. XCede. See section 4 regarding XHD2 RAM connectors. Discover More. The applications for these connectors include IEEE 10GBASE-KR and 25GBASE-KR, or. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks.